发明名称 MOBILE PHONE
摘要 <P>PROBLEM TO BE SOLVED: To provide a board structure and an electronic apparatus in which a resin part that covers a plurality of electronic parts altogether has shielding characteristics and the mounting strength of the electronic parts mounted on the board can be secured. <P>SOLUTION: A board structure 10 includes a board 11, a plurality of electronic parts 12 mounted along the board 11, and a resin part 13 covering each of the electronic parts 12 with resin 18 and being in firm contact with the board 11. This board structure 10 further includes a frame 15 surrounding the electronic parts 12 and being in firm contact with the board 11 and a cover 17 closing an opening 16 of the frame 15. The resin 18 is filled inside the frame 15. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009027191(A) 申请公布日期 2009.02.05
申请号 JP20080261535 申请日期 2008.10.08
申请人 PANASONIC CORP 发明人 ONO MASAHIRO;UDA YOSHIHIRO;YAMAGUCHI SEIJI;SHINCHI KAZUHIRO;TOMEKAWA SATORU
分类号 H05K9/00;H01L23/28;H01L25/04;H01L25/18;H04M1/02;H05K5/00 主分类号 H05K9/00
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