发明名称 SUBSTRATE PROCESSING APPARATUS, PROGRAM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 A substrate processing apparatus includes: a substrate holder configured to hold a substrate; a gas supply unit configured to supply gas of processing the substrate; a plasma electrode device provided separately above a surface of the substrate, configured to generate plasma of activating the gas supplied from the gas supply unit; and a rotation driving unit connected to the plasma electrode device, configured to horizontally move the plasma electrode device above the substrate.
申请公布号 US2016284543(A1) 申请公布日期 2016.09.29
申请号 US201615078503 申请日期 2016.03.23
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 TOYODA Kazuyuki;SATO Akihiro;HIROCHI Yukitomo
分类号 H01L21/02;H01J37/32;H01L21/673 主分类号 H01L21/02
代理机构 代理人
主权项 1. A substrate processing apparatus comprising: a substrate holder configured to hold a substrate; a gas supply unit configured to supply gas of processing the substrate; a plasma electrode device provided separately above a surface of the substrate, configured to generate plasma of activating the gas supplied from the gas supply unit; and a rotation driving unit connected to the plasma electrode device, configured to horizontally move the plasma electrode device above the substrate.
地址 Tokyo JP