| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer edge inspection device that has a simple constitution and can precisely perform chipping inspection by preventing a dark part from being left at a bevel, a notch and an orientation flat part of a wafer.SOLUTION: A wafer edge inspection part 100 comprises: mounting means 10 which mounts a wafer 200 in an imaging region; dome type lighting means 20 which irradiates a region including a bevel 201 of the wafer 200 in the imaging region with light, and has an inner side face formed of a hemispherical body having a reflecting surface and a center axis O of the hemispherical surface being arranged to be located on a center face S of the wafer 200 on the mounting means 10; and imaging means 30 which is arranged at a position where an optical axis X is substantially perpendicular to the center face S of the wafer 200 on the mounting means 10 and crosses a vicinity of the bevel 201 of the wafer 200 irradiated with light by the lighting means 20, and images a region including the bevel 201 of the wafer 200 in the imaging region.SELECTED DRAWING: Figure 1 |
