Wiring board and method for manufacturing the same

摘要

A wiring board includes a first interlayer insulation layer, a second interlayer insulation layer formed on the first interlayer insulation layer and having an opening portion, first conductive pads formed on the second interlayer insulation layer, a conductive plane layer formed on the first interlayer insulation layer such that the conductive plane layer is exposed by the opening portion of the second interlayer insulation layer, a wiring structure positioned directly on the conductive plane layer such that the wiring structure is accommodated in the opening portion of the second interlayer insulation layer, and second conductive pads formed on the wiring structure such that the first conductive pads and the second conductive pads are set to be positioned on a same plane.

主权项

1. A wiring board, comprising:
a first interlayer insulation layer; a second interlayer insulation layer formed on the first interlayer insulation layer and having an opening portion; a plurality of first conductive pads formed on the second interlayer insulation layer; a conductive plane layer formed on the first interlayer insulation layer such that the conductive plane layer is exposed by the opening portion of the second interlayer insulation layer; a wiring structure positioned directly on the conductive plane layer such that the wiring structure is accommodated in the opening portion of the second interlayer insulation layer; and a plurality of second conductive pads formed on the wiring structure such that the plurality of first conductive pads and the plurality of second conductive pads are set to be positioned on a same plane.