High bandwidth differential lead with device connection

摘要

A high bandwidth solder-less lead may be connected to an electrical device having land patterns so that signals on the device may be more easily measured through the lead. The lead includes an attachment mechanism to mount the lead on the device, a microspring housing and at least one microspring. The microspring connects one of the particular land patterns on the device to the lead where it may be easier to couple to a measurement device than to the electrical device itself. The lead may be coupled to a flexible electrical conduit to make attaching to the testing device even easier. In other versions, a uniform connector may be temporarily attached to the solder-less lead to test the device. Then the connector may be disconnected from the first lead and connected to another lead to test another area of the device.

主权项

1. A measuring system for measuring signals from an electrical device, the measuring system comprising:
a solder-less lead including:
a support bracket;an attachment mechanism structured to securely attach the support bracket to the device,a probe signal pad,a microspring housing,a microspring carried in the housing, a portion of the microspring extending beyond a surface of the microspring housing when the microspring is unsprung, and the microspring structured to electrically couple, on a first end, to the electrical device when the lead is attached to the device by the attachment mechanism, and couple to the probe signal pad on the second end; and a connector structured to be temporarily coupled to the solder-less lead, the connector comprising:
a latch structured to temporarily couple to the support bracket of the lead,a microspring housing,a microspring carried in the housing, a portion of the microspring extending beyond a surface of the microspring housing when the microspring is unsprung, and the microspring structured to electrically couple to the probe signal pad of the lead when the connector is coupled to the lead.