发明名称 |
METHOD FOR MANUFACTURING THIN FILM CHIP RESISTOR DEVICE |
摘要 |
A method for manufacturing a thin film chip resistor device includes the steps of: disposing a magnetic fixing member on a first surface of a substrate, and disposing a magnetic shadow mask on a second surface of the substrate opposite to the first surface, such that the magnetic shadow mask detachably and fixedly contacts the second surface of the substrate by virtue of an attractive magnetic force between the magnetic fixing member and the magnetic shadow mask; and depositing at least one resistor unit on the second surface of the substrate with the use of the magnetic shadow mask, the resistor unit including two separated first electrode elements and a resistor element that electrically interconnects the first electrode elements. |
申请公布号 |
US2016351307(A1) |
申请公布日期 |
2016.12.01 |
申请号 |
US201514946155 |
申请日期 |
2015.11.19 |
申请人 |
RALEC ELECTRONIC CORPORATION |
发明人 |
WANG WAN-PING |
分类号 |
H01C17/00;H01C17/22;H01C17/28;H01C17/08 |
主分类号 |
H01C17/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method for manufacturing a thin film chip resistor device, comprising the steps of:
disposing a magnetic fixing member on a first surface of a substrate, and disposing a magnetic shadow mask on a second surface of the substrate opposite to the first surface, such that the magnetic shadow mask detachably and fixedly contacts the second surface of the substrate by virtue of an attractive magnetic force between the magnetic fixing member and the magnetic shadow mask; and depositing at least one resistor unit on the second surface of the substrate with the use of the magnetic shadow mask, the resistor unit including two separated first electrode elements and a resistor element that electrically interconnects the first electrode elements. |
地址 |
KAOHSIUNG TW |