发明名称 VERFAHREN ZUR VERBINDUNG VON ELEKTRONISCHEN BAUSTEINEN IN EINER KREDITKARTENARTIGEN TRAGBAREN VORRICHTUNG
摘要 The invention concerns a method for producing, in a nomadic object (1) in the form of a credit card, interconnections between electronic components (2, 3, 5, 6, 7, 8) contained in said nomadic object (1). The nomadic electronic object (1) comprises two shells (1a, 1b) between which are inserted said electronic components (2, 3, 5, 6, 7, 8) comprising electrical contact pads (9). The method comprises the following steps: printing a conductive layer (1d) on the inner surface of at least one of the shells (1a), at least at the site of the connections to be produced between said electronic components (2, 3, 5, 6, 7, 8); applying the conductive layers (1d, 1c) of said shells (1a, 1b) on the electrical contact pads (9) of the electronic components (2, 3, 5, 6, 7, 8), in particular by conductive bonding and/or welding and/or soldering and/or pressure, thereby producing galvanic contacts.
申请公布号 AT422808(T) 申请公布日期 2009.02.15
申请号 AT20010460030T 申请日期 2001.04.26
申请人 AUDIOSMARTCARD INTERNATIONAL S.A. 发明人 MOULIN, JEAN;GAYET, ALAIN
分类号 H05K1/00;G06K19/077;H05K1/14 主分类号 H05K1/00
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