发明名称 Self-heating circuit board
摘要 Separate heating elements are embedded in a printed circuit board near integrated circuit (IC) packages or other parts mounted on the circuit board. Each heating element supplies heat to the part residing near it in response to an input voltage pulse. The heating elements are used to selectively melt solder or adhesives attaching the parts to the circuit board so that they can be easily removed or to temporarily melt solder or cure adhesive when the parts are mounted on the circuit board. The heating elements are also used to supply heat to IC packages for regulating their operating temperatures.
申请公布号 US6396706(B1) 申请公布日期 2002.05.28
申请号 US19990364684 申请日期 1999.07.30
申请人 CREDENCE SYSTEMS CORPORATION 发明人 WOHLFARTH PAUL D.
分类号 H05K1/02;H05K1/16;H05K3/34;H05K3/46;H05K7/20;(IPC1-7):H05K7/06 主分类号 H05K1/02
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