| 摘要 |
Application of a conductive material with a compliant underlayer onto selected pads of a substrate, includes forming at least one padstack, by patterning a sheet including a stack of material layers. Padstacks may include a first conductive top layer, one or more underlying layers, and a bottom attachment layer, such as a solder layer. At least one flexible, or compliant, layer is disposed in the sheet between the top and attachment layers. The compliant layer may be a conductive elastomer. The top layer of the padstacks are adhered to a soluble tape, and this composite structure is moved into place over the circuit board by means of a pick and place operation. The placement of the padstacks is followed by a solder reflow to adhere the padstacks to the contact pads of the substrate, and by a wash cycle with a solvent to remove the soluble tape.
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