| 摘要 |
PROBLEM TO BE SOLVED: To provide a shielded high-frequency module capable of access inside a shield while suppressing the effectiveness degradation of the shield. SOLUTION: The high-frequency circuit module is provided with: the conductive frame 110 electrically coupled to a top surface of a printed circuit board (PCB) 150 and a lid and including inner walls 118 which define a circuit region 114, at least a portion of which includes a circuit on the top surface of the PCB 150; and a connector 130 adapted to interface the circuit region 114 with high-frequency signals outside the conductive frame 110 and provided with an outer conductor disposed within the conductive frame 110. At least a portion of the connector 130 is electrically coupled to the conductive frame 110, and the inner walls 118 of the conductive frame 110, the top surface of the PCB 150 and the lid define the shield surrounding the circuit region 114. COPYRIGHT: (C)2009,JPO&INPIT
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