COATING TREATMENT METHOD, COMPUTER STORAGE MEDIUM AND COATING TREATMENT APPARATUS

摘要

The present invention evenly coats the surface of a substrate with coating liquid while suppressing the supply quantity of the coating liquid in a small quantity when coating the substrate with the coating liquid. The present invention relates to a method of coating the surface of a wafer with coating liquid. The method: forms a liquid film with a raw material on the outer circumference part of the wafer in a ring shape by supplying the raw material of the coating liquid to the wafer; supplies the coating liquid to the central part of the wafer while rotating the wafer at a first rotation speed (time t_1 ~ t_2); and spreads the coating liquid to the surface of the substrate by rotating the wafer at a second rotation speed faster than the first rotation speed (time t_4 ~ t_5). The supply of the raw material is continuously performed until the coating liquid becomes in contact with the liquid film (time t_0 ~ t_3).