发明名称 Low-profile capillary for wire bonding
摘要 A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.
申请公布号 US7500591(B2) 申请公布日期 2009.03.10
申请号 US20070839198 申请日期 2007.08.15
申请人 KULICKE AND SOFFA INDUSTRIES, INC. 发明人 EDER JAMES E.;BRUNNER JON W.
分类号 B23K37/00;B23K1/19;B23K20/00;B23K31/00;B23K31/02 主分类号 B23K37/00
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