发明名称 |
Low-profile capillary for wire bonding |
摘要 |
A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.
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申请公布号 |
US7500591(B2) |
申请公布日期 |
2009.03.10 |
申请号 |
US20070839198 |
申请日期 |
2007.08.15 |
申请人 |
KULICKE AND SOFFA INDUSTRIES, INC. |
发明人 |
EDER JAMES E.;BRUNNER JON W. |
分类号 |
B23K37/00;B23K1/19;B23K20/00;B23K31/00;B23K31/02 |
主分类号 |
B23K37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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