| 发明名称 |
Composite Sheet for Resin Film Formation |
| 摘要 |
The present invention relates to a composite sheet for resin film formation composed of a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer on a base and a heat curable film for resin film formation provided on the pressure-sensitive adhesive layer. The film for resin film formation includes a binder component having a reactive double bond group. The pressure-sensitive adhesive layer includes a non-energy ray curable pressure-sensitive adhesive composition or a cured product of an energy ray curable pressure-sensitive adhesive composition. |
| 申请公布号 |
US2016218077(A1) |
申请公布日期 |
2016.07.28 |
| 申请号 |
US201415023702 |
申请日期 |
2014.09.29 |
| 申请人 |
LINTEC CORPORATION |
发明人 |
Azuma Yuichiro;Tsuchiyama Sayaka;Kabuto Akio |
| 分类号 |
H01L23/00;H01L23/29;H01L23/31 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A composite sheet for resin film formation comprising:
a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer on a base and a heat curable film for resin film formation provided on the pressure-sensitive adhesive layer, wherein the film for resin film formation includes a binder component having a reactive double bond group, and the pressure-sensitive adhesive layer comprises a non-energy ray curable pressure-sensitive adhesive composition or a cured product of an energy ray curable pressure-sensitive adhesive composition. |
| 地址 |
Tokyo JP |
