发明名称 Step Drill Test Structure of Layer Depth Sensing on Printed Circuit Board
摘要 A step drill test structure for a PCB and method for using the same is disclosed. In one embodiment, a test structure includes a drill path and a connection via. The drill path may include sensing pads on selected ones of a plurality of layers of the PCB (e.g., the non-surface layers). The sensing pads of a given drill path may be electrically conductive, while the remaining portion of the drill path is non-conductive. The sensing pads of each drill path may be electrically coupled to the connection via. The depth of a given layer at a particular drill path may be determined by drilling, using an electrically conductive drill bit, into the drill path and determining when an electrical connection is made between the drill bit and the connection via.
申请公布号 US2016245857(A1) 申请公布日期 2016.08.25
申请号 US201615144206 申请日期 2016.05.02
申请人 Oracle International Corporation 发明人 Moran Stephanie;Freda Michael C.;Sauter Karl
分类号 G01R31/28 主分类号 G01R31/28
代理机构 代理人
主权项
地址 Redwood City CA US