Polishing pad cleaning with vacuum apparatus

摘要

In one embodiment, a method for cleaning a surface of a polishing pad includes conditioning the polishing pad surface and rotating the conditioned polishing pad surface. The method also includes spraying the polishing pad surface to lift debris from the conditioned polishing pad surface. The method further includes vacuuming the debris from the polishing pad surface downstream from where the condition occurs, wherein downstream is defined by a rotational direction of the polishing pad. In another embodiment, a processing station including a rotatable platen, a substrate carrier head, a polishing fluid delivery system, a conditioner, a spray nozzle, and a vacuum system is provided. The conditioner is disposed between the substrate carrier head and the spray nozzle. The vacuum system is configured to vacuum the polishing pad surface. The vacuum system is downstream from the conditioner, defined by a rotation of the platen.

主权项

1. A method for cleaning a surface of a polishing pad, comprising:
conditioning the polishing pad surface; rotating the conditioned polishing pad surface; spraying the polishing pad surface to lift debris from the conditioned polishing pad surface from a vacuum assembly that is movable in a linear or arcing motion over the polishing pad surface; and vacuuming the lifted debris from the polishing pad surface downstream from where the spraying and conditioning occurs using the vacuum assembly, defined by a rotational direction of the polishing pad.