| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant adhesive film excellent in low-temperature adhesiveness and a semiconductor device using the same and showing excellent reflow crack resistance. SOLUTION: There are provided a heat-resistant adhesive film wherein the adhesive comprises at least one resin selected among aromatic polyamides, aromatic polyimides, aromatic polyamide imides, aromatic polyether amides, aromatic polyether imides, aromatic polyether amide imides, aromatic polyesters and aromatic polyethers each of which has an odd number (desirably, 3, 5, 7, 9 or 11) of contiguous carbon atoms in the main chain and a semiconductor device using the same. |
