| 摘要 |
A semiconductor package and a method of manufacture thereof are provided to cover the substrate to the first and the second shielding layer and to block the electromagnetic interference. The first shield layer(18) is adhered to the first side of substrate. The RF module(24) is mounted on the first area on the second side of substrate through a plurality of solder bumps. The baseband module(26) is mounted on the second part on the second side of substrate through a plurality of solder bumps. The second shielding layer(30) covers the second side of substrate, the RF module and baseband module. The first and second shielding layers cover the wafer level semiconductor package. The baseband module is isolated from the electromagnetic interference generated by RF module. |
