| 摘要 |
<p>PURPOSE:To obtain a semiconductor sealing method which can avoid the adverse influence of a heating process for forming the guard ring of a circuit board by thermally curing a sealing resin by blowing a hot blast upon the resin while the resin is fed to the place where the guard ring of a circuit board is formed and, at the same time, sucking the hot blast. CONSTITUTION:A sealing resin 16 is thermally cured by blowing a hot blast 28 upon the resin 16 while the resin 16 is fed to the place where the guard ring 18 of a circuit board 2 is formed and, at the same time, the hot blast 28 blown upon the resin 16 is sucked. Since the hot blast 28 blown upon the resin 16 used for forming the guard ring 18 is sucked, heating of the other parts than the guard ring 18, especially, heating of the sealing resin 16 while the resin is in a syringe 20 which is a sealing resin feeding means is prevented and the deterioration of the resin 16 can be prevented. Therefore, the sealing resin 16 fed to the circuit board 2 can be protected front the hot blast and the quality and reliability of the guard ring 18 can be improved.</p> |
