A multilayer package includes a plurality of interconnected large-layer-count (LLC) substrates. The LLC substrates each include conductive pads on the top and bottom surfaces of the substrate, a via in the substrate including conductive material to contact the pads on the top and bottom surfaces, and a post on a pad over the via. The posts of the substrates confront and abut each other, and are electrically bonded together. A non-flowable adhesive film mechanically bonds the LLC substrates, and has an aperture receiving the posts of the substrates.
申请公布号
US5986339(A)
申请公布日期
1999.11.16
申请号
US19980115575
申请日期
1998.07.14
申请人
GENERAL DYNAMICS INFORMATION SYSTEMS, INC.
发明人
PAI, DEEPAK K.;DENNY, RONALD R.;CHEVALIER, JEANNE M.;SCHWARTZ, III, GEORGE F.;WEBSTER, CLARK F.;LUFKIN, ROBERT M.;KRINKE, TERRANCE A.