发明名称 POLISHING/CLEANING METHOD WITH SLURRY OF VOLATILE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a polishing/cleaning method for solid fine particles and contaminants which cannot be removed by a cleaning operation with a normal cleaning liquid or where no brush or abrasive can be used or no sufficient effect is expected with them. SOLUTION: The gas hydration of a normal cleaning liquid or the partial solidification of the cleaning liquid forms the slurry of volatile material containing solid particles. The slurry is jetted against an object to be polished/cleaned, so that no solid particle remains on the object after polishing/cleaning while the collision of solid particles of the slurry raises a polishing/cleaning effect as well as the cleaning effect of the cleaning liquid. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005236178(A) 申请公布日期 2005.09.02
申请号 JP20040046011 申请日期 2004.02.23
申请人 NAKAYA KEIJI 发明人 NAKAYA KEIJI
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
代理机构 代理人
主权项
地址