| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can simultaneously clean the upper and lower surface of a semiconductor wafer, and moreover surely. SOLUTION: The substrate processing apparatus includes a processing tank 1, which has an in/out port 2 formed in one side thereof; holding/driving means 8 which is provided at a position facing the in/out port in the processing tank, and which holds both ends of a semiconductor wafer 10 carried into the processing tank in the radial direction, with the diameter extending so as to intersect with the carry-in direction thereof, and which rotates the semiconductor wafer; cleaning nozzles 124, 125 which supply processing liquid to the semiconductor wafer held at the holding/driving means; arms 63, 121 which are provided at positions farther inward than the holding/driving means in the processing tank, and which has cleaning brushes 71, 122 at their tips for cleaning the surface of the semiconductor wafer; tool units 61, 62 which has driving means for driving the arms in the vertical direction and for rockingly driving the arms, such that the cleaning brushes move along the radial direction of the semiconductor wafer. COPYRIGHT: (C)2008,JPO&INPIT
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