METHOD AND APPARATUS FOR AUTOMOTIVE RADAR SENSOR

摘要

An integrated circuit package (510) is disclosed for radar applications An integrated circuit die is connected to a high-frequency package substrate (540) using a high-frequency die to substrate interconnect (535) The high-frequency package substrate (540) is connected to an external circuit by way of a mechanically stress-relieved package substrate external interconnect (545) and the substr (540) contains a high frequency signal radiator (548)