| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treating apparatus capable of preventing lowering of the quality of treatment for forming a coated film on substrates. SOLUTION: Provided are coating units 31, heat-treating units 41, and a first main transport mechanism T<SB>1</SB>for transporting substrates W to each of these treating units 31 and 41. The substrates W are transferred from the first main transport mechanism T<SB>1</SB>to a second main transport mechanism T<SB>2</SB>through a mounting section PASS<SB>2</SB>. When a substrate W cannot be placed on the mounting section PASS<SB>2</SB>, this substrate W is placed on a buffer BF2. Thus, the first main transport mechanism T<SB>1</SB>can continue transporting other substrates W. The other substrates W in the treating units 31 and 42 are transported between the treating units 31 and 41 without delay, to be subjected to a series of treatments including coating treatment and heat treatment as scheduled. This prevents lowering of the quality of treatment for forming the coated film on the substrates. COPYRIGHT: (C)2009,JPO&INPIT
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