| 摘要 |
Radio frequency identification (RFID) tags and processes for manufacturing t he same. The RFID device generally includes (1) a metal antenna and/or inductor; (2) a dielectric layer thereon, to support and insulate integrated circuitry from the metal antenna and/or inductor; (3) a plurality of diodes and a plurality of transistors on the dielectric layer, the diodes having at least one layer in common with the transistors; and (4) a plurality of capacitors in electrical communication with the metal antenna and/or inductor and at least some of th e diodes, the plurality of capacitors having at least one layer in common with the plurali ty of diodes and/or with contacts to the diodes and transistors. The method preferably integrate s liquid silicon- containing ink deposition into a cost effective, integrated manufacturing process for the manufacture of RFID circuits. Furthermore, the present RFID tags generally provide higher performance (e.g., improved electrical characteristics) as compared to tags containing organic electronic devices.
|
