发明名称 Controlled cooling methods and apparatus for laser sintering part-cake
摘要 The invention is a method for controllably cooling at least a portion of a part-cake from a laser sintering system to minimize cool down time, maximize throughput, and minimize thermal gradients within the part-cake. The method generally comprises forming one or more thermal transfer channels within the part-cake. The thermal transfer channels can include ducts and cooling fins in the part-cake surrounding the formed part. The method can further comprise removing unfused powder from the ducts and introducing cooling media into the ducts. The invention also includes a part-cake having thermal transfer channels formed therein and a laser sintering apparatus comprising a part-cake containing cylinder having permanent fittings therein for receiving terminal portions of thermal transfer channels formed in the part-cake.
申请公布号 US7521652(B2) 申请公布日期 2009.04.21
申请号 US20040005740 申请日期 2004.12.07
申请人 3D SYSTEMS, INC. 发明人 CHUNG TAE MARK;BISHOP RAYMOND J.;GEVING BRADLEY DAVID;FONG JON JODY;DUNNE PATRICK
分类号 B23K26/14;B22F7/00 主分类号 B23K26/14
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