| 摘要 |
PROBLEM TO BE SOLVED: To provide a die attach paste giving a cured product excellent in conductivity, and, when used in a semiconductor device or the like, good in adhesive strength and also excellent in workability.SOLUTION: A die attach paste contains an epoxy resin (A), a phenol-based hardener (B), silver-coated copper powder (C), an imidazole-based curing accelerator (D), a silane coupling agent (E), and a diluent (F), as essential components. In the die attach paste, 60-95 mass% of the total blended amount of the silver-coated copper powder (C) is dendritic silver-coated copper powder. In a method for producing the die attach paste, a resin composition including the components (A)-(F) is mixed by a planetary stirring unit, and then subjected to roll kneading. A semiconductor device is manufactured using the die attach paste. |
