发明名称 Self aligned replacement metal source/drain finFET
摘要 A method of a fin-shaped field effect transistor (finFET) device includes forming at least one fin that extends in a first direction; covering the fin with a dummy gate stack that extends in a second direction perpendicular to the first direction and that divides the at least one fin into source and drain regions on opposing sides of the replacement gate stack; covering the source and drain regions with an interlayer dielectric; replacing the dummy gate stack with a replacement metal gate stack; performing a first anneal at a first temperature after the replacement metal gate stack has replaced the dummy gate stack; and after performing the first anneal: recessing a top portion of the interlayer dielectric; and forming metallic source and drain regions.
申请公布号 US9466693(B1) 申请公布日期 2016.10.11
申请号 US201514943652 申请日期 2015.11.17
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 Alptekin Emre;Robison Robert R.;Vega Reinaldo A.
分类号 H01L21/8234;H01L29/66;H01L29/40;H01L29/78;H01L29/06;H01L29/417 主分类号 H01L21/8234
代理机构 Cantor Colburn LLP 代理人 Cantor Colburn LLP ;Meyers Steven
主权项 1. A method of forming a fin-shaped field effect transistor (finFET) device, the method comprising: forming at least one fin that extends in a first direction; covering the fin with a dummy gate stack that extends in a second direction perpendicular to the first direction and that divides the at least one fin into source and drain regions on opposing sides of the dummy gate stack; covering the source and drain regions with an interlayer dielectric; replacing the dummy gate stack with a replacement metal gate stack; performing a first anneal at a first temperature after the replacement metal gate stack has replaced the dummy gate stack; after performing the first anneal: recessing a top portion of the interlayer dielectric; and forming metallic source and drain regions.
地址 Armonk NY US