发明名称 |
Self aligned replacement metal source/drain finFET |
摘要 |
A method of a fin-shaped field effect transistor (finFET) device includes forming at least one fin that extends in a first direction; covering the fin with a dummy gate stack that extends in a second direction perpendicular to the first direction and that divides the at least one fin into source and drain regions on opposing sides of the replacement gate stack; covering the source and drain regions with an interlayer dielectric; replacing the dummy gate stack with a replacement metal gate stack; performing a first anneal at a first temperature after the replacement metal gate stack has replaced the dummy gate stack; and after performing the first anneal: recessing a top portion of the interlayer dielectric; and forming metallic source and drain regions. |
申请公布号 |
US9466693(B1) |
申请公布日期 |
2016.10.11 |
申请号 |
US201514943652 |
申请日期 |
2015.11.17 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
Alptekin Emre;Robison Robert R.;Vega Reinaldo A. |
分类号 |
H01L21/8234;H01L29/66;H01L29/40;H01L29/78;H01L29/06;H01L29/417 |
主分类号 |
H01L21/8234 |
代理机构 |
Cantor Colburn LLP |
代理人 |
Cantor Colburn LLP ;Meyers Steven |
主权项 |
1. A method of forming a fin-shaped field effect transistor (finFET) device, the method comprising:
forming at least one fin that extends in a first direction; covering the fin with a dummy gate stack that extends in a second direction perpendicular to the first direction and that divides the at least one fin into source and drain regions on opposing sides of the dummy gate stack; covering the source and drain regions with an interlayer dielectric; replacing the dummy gate stack with a replacement metal gate stack; performing a first anneal at a first temperature after the replacement metal gate stack has replaced the dummy gate stack; after performing the first anneal: recessing a top portion of the interlayer dielectric; and forming metallic source and drain regions. |
地址 |
Armonk NY US |