发明名称 金型加熱装置
摘要 PROBLEM TO BE SOLVED: To provide a mold heating device which preferably heats a mold, in which a predetermined treatment is performed on one surface, to improve the quality of a predetermined processing layer and achieves reduction of predetermined processing steps.SOLUTION: A mold heating device 1 heats a mold 10 in which a treatment is performed on one surface 10a and includes: a base member 2; a support base 3 which is disposed in the base member 2 and supports the other surface 10b of the mold 10 so that a space part 3a is formed between the base member 2 and the other surface 10b; an induction coil 4 disposed in the space part 3a and configured to heat the mold 10 from the other surface 10b; and a control unit 5 which controls operation of the induction coil 4.SELECTED DRAWING: Figure 2
申请公布号 JP6010593(B2) 申请公布日期 2016.10.19
申请号 JP20140215241 申请日期 2014.10.22
申请人 本田技研工業株式会社 发明人 松本 智;杉本 淳二;下川 陽平;岩本 年矢;藤山 晋輔;生方 信孝
分类号 B22D18/04;B22C9/06;B22C11/04;B22D45/00;H05B6/06;H05B6/10;H05B6/36 主分类号 B22D18/04
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