| 摘要 |
PROBLEM TO BE SOLVED: To provide a flip chip connection method, wherein a self-alignment effect is provided easily, in flip chip mounting in which a pad and a chip on a circuit board are made to contact each other in a face-down method. SOLUTION: For a flip chip mounting method in face-down method, a solder 7 does not melt before a bump 2 of a bare chip 3 contacts to the solder 7 on a circuit board 5, and after the bump 2 of the bare chip 3 makes contact with the solder 7 on the circuit board 5, the solder 7 is melted, and the bare chip 3 is released from an attraction action by a heating tool 4, while the molten state of the solder 7 is kept. |
