发明名称 Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
摘要 A semiconductor device is provided with a plurality of protrusions which are made of a resin and which protrude higher than electrodes, and conductive layers which are electrically connected to the electrodes and which cover the top surfaces of the protrusions. A method for manufacturing the semiconductor device includes a step of applying a layer of the resin to the semiconductor device except for the electrodes, a step of patterning the conductive layers on the electrodes and the layer of the resin in accordance with the protrusions, and a step of removing the layer of the resin located between the conductive layers by the use of the patterned conductive layers as masks so as to form the protrusions.
申请公布号 US2005170602(A1) 申请公布日期 2005.08.04
申请号 US20050099255 申请日期 2005.04.05
申请人 ITO HARUKI 发明人 ITO HARUKI
分类号 G02F1/13;G02F1/1345;H01L21/3205;H01L21/60;H01L23/485;H01L23/52;(IPC1-7):H01L21/20 主分类号 G02F1/13
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