发明名称 |
Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment |
摘要 |
A semiconductor device is provided with a plurality of protrusions which are made of a resin and which protrude higher than electrodes, and conductive layers which are electrically connected to the electrodes and which cover the top surfaces of the protrusions. A method for manufacturing the semiconductor device includes a step of applying a layer of the resin to the semiconductor device except for the electrodes, a step of patterning the conductive layers on the electrodes and the layer of the resin in accordance with the protrusions, and a step of removing the layer of the resin located between the conductive layers by the use of the patterned conductive layers as masks so as to form the protrusions.
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申请公布号 |
US2005170602(A1) |
申请公布日期 |
2005.08.04 |
申请号 |
US20050099255 |
申请日期 |
2005.04.05 |
申请人 |
ITO HARUKI |
发明人 |
ITO HARUKI |
分类号 |
G02F1/13;G02F1/1345;H01L21/3205;H01L21/60;H01L23/485;H01L23/52;(IPC1-7):H01L21/20 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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