| 摘要 |
PROBLEM TO BE SOLVED: To enable a yield to be improved and to enable reliability to be improved by preventing a bonded insulating films from being separated by raising the adhesiveness between the insulating films used for a multilayer wiring structure. SOLUTION: In a semiconductor device 1 having the multilayer wiring structure on a substrate 11, the insulating film for electrically insulating between the wiring layers of the multilayer wiring structure is made of a laminate of the first insulating film 21 and the second insulating film 22. Between the first insulating film 21 and the second insulating film 22, a chemical which raises the adhesiveness of the first insulating film 21 and the second insulating film 22 is applied on the periphery of the first insulating film 21. COPYRIGHT: (C)2005,JPO&NCIPI
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