发明名称 |
Wiring board, method for manufacturing same, and semiconductor package |
摘要 |
A wiring board in which lower-layer wiring composed of a wiring body and an etching barrier layer is formed in a concave portion formed on one face of a board-insulating film, upper-layer wiring is formed on the other face of the board-insulating film, and the upper-layer wiring and the wiring body of the lower-layer wiring are connected to each other through a via hole formed in the board-insulating film. The via hole is barrel-shaped, bell-shaped, or bellows-shaped.
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申请公布号 |
US2006283625(A1) |
申请公布日期 |
2006.12.21 |
申请号 |
US20060452933 |
申请日期 |
2006.06.15 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
YAMAMICHI SHINTARO;KIKUCHI KATSUMI;MURAI HIDEYA;FUNAYA TAKUO;MAEDA TAKEHIKO;OGAWA KENTA;TSUKANO JUN;HONDA HIROKAZU |
分类号 |
H05K1/11;H05K1/03 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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