发明名称 |
POWER SEMICONDUCTOR MODULE |
摘要 |
The invention relates to a power semiconductor module (1) comprising at least two power semiconductor units (11) that are interconnected and that have controllable semiconductors, every semiconductor unit (11) being associated with a cooling plate (3, 4) to which the semiconductors are connected in a heat-conducting manner. The aim of the invention is to provide a semiconductor module of the above type which is compact and cost-effective and at the same time explosion-proof. The power semiconductor module according to the invention is characterized by comprising a module housing (2) which houses the power semiconductor units (11), the cooling plates (3, 4) configuring at least part of the module housing. |
申请公布号 |
WO2009062534(A1) |
申请公布日期 |
2009.05.22 |
申请号 |
WO2007EP09995 |
申请日期 |
2007.11.13 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT;DORN, JOERG;KUEBEL, THOMAS |
发明人 |
DORN, JOERG;KUEBEL, THOMAS |
分类号 |
H01L23/40;H01L25/07;H01L25/11 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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