发明名称 POWER SEMICONDUCTOR MODULE
摘要 The invention relates to a power semiconductor module (1) comprising at least two power semiconductor units (11) that are interconnected and that have controllable semiconductors, every semiconductor unit (11) being associated with a cooling plate (3, 4) to which the semiconductors are connected in a heat-conducting manner. The aim of the invention is to provide a semiconductor module of the above type which is compact and cost-effective and at the same time explosion-proof. The power semiconductor module according to the invention is characterized by comprising a module housing (2) which houses the power semiconductor units (11), the cooling plates (3, 4) configuring at least part of the module housing.
申请公布号 WO2009062534(A1) 申请公布日期 2009.05.22
申请号 WO2007EP09995 申请日期 2007.11.13
申请人 SIEMENS AKTIENGESELLSCHAFT;DORN, JOERG;KUEBEL, THOMAS 发明人 DORN, JOERG;KUEBEL, THOMAS
分类号 H01L23/40;H01L25/07;H01L25/11 主分类号 H01L23/40
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