发明名称 SPUTTERING TARGET
摘要 PROBLEM TO BE SOLVED: To provide a sputtering target constituted of split targets having different thicknesses from each other and capable of easily removing any bonding material from a space formed in adjacent parts of the split targets. SOLUTION: In the sputtering target, a target constituted of a plurality of split targets and a backing plate are integrally bonded with each other via a bonding material. The backing plate is formed in a substantially projecting-shaped section, and end split targets arranged at ends of the sputtering target out of the split targets are formed in a substantially L-shaped section, and other split targets than the end targets are formed in a flat shape. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009057598(A) 申请公布日期 2009.03.19
申请号 JP20070225707 申请日期 2007.08.31
申请人 MITSUI KINZOKU KOREA CO LTD 发明人 KOGA YOICHI;JI DONGGU
分类号 C23C14/34;C23C14/08 主分类号 C23C14/34
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