SEALING AGENT FOR GOLD-PLATED FILM, AND ITS USE

摘要

PROBLEM TO BE SOLVED: To provide a sealing agent and a sealing method of pin holes in a gold-plated film for forming a chemical conversion film having excellent heat resistance on the surface of a base metal of the gold plated film; to provide a printed circuit board with a chemical conversion film deposited on a surface of the base metal of the gold-plated film by bringing the sealing agent on the surface of the gold-plated film of a metal conductive part; and to provide a manufacturing method of a printed circuit board for performing the soldering by using lead-free solder after depositing the chemical conversion film on the surface of the base metal of the gold-plated film by bringing the sealing agent into contact with the surface of the gold-plated film. SOLUTION: This sealing agent for the gold-plated film contains a specified imidazole compound as an effective component. COPYRIGHT: (C)2009,JPO&INPIT