| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-conductive resin composition having high heat conductivity and electric insulation suitable as an electric or electronic component, and giving a molding having excellent mechanical strength. SOLUTION: [1] The heat-conductive resin composition including the following components (A)-(C): (A) a thermoplastic resin and/or a thermosetting resin; (B) a granular material of 0.5-5 mm number average particle diameter obtained by granulating fiber mainly consisting of alumina of 1-50μm number average fiber diameter; and (C) a compound represented by formula (1), and meltable at a temperature lower than a melting temperature of the component (A). [2] The heat-conductive resin composition of [1] wherein the component (A) is a liquid crystal polyester. [3] The molding formed by shaping the heat-conductive resin composition of [1] or [2]. COPYRIGHT: (C)2009,JPO&INPIT
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