| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board that is able to reduce high frequency reflection loss.SOLUTION: Anti-pad regions 6, 13 where ground planes 9, 12 are selectively removed are formed between metal pads 5, 8 and the ground planes 9, 12 of a multilayer wiring board 1, and a plan view circular removal region 21 where a ground plane 11 is selectively removed is formed between a high frequency signal veer 7 and the ground plane 11. The distance from tips of the metal pads 5, 8 in the longitudinal direction of high frequency lines 2, 15 in an in-plane direction in which the ground planes 9, 12 are formed is longer than the distance from the tips of the metal pads 5, 8 in the direction vertical to the longitudinal direction of the high frequency lines 2, 15 to the ground planes 9, 12. |
