CIRCUIT STRUCTURE AND CIRCUIT STRUCTURE WITH HEAT RADIATING BODY

摘要

Provided is a circuit structure (1) having high rigidity and a circuit structure (100) with a heat radiating body. The circuit structure (1) comprises a circuit board (2), a plurality of busbars (3), an electronic component (4) and an adhesive (5). The circuit board (2) has an opening (21) passing therethrough in the thickness direction. The busbars (3) are composed of a conductor and are overlaid on the circuit board (2). The electronic component (4) is soldered to the busbars (3) through the opening (21). The adhesive (5) bonds the circuit board (2) and the busbars (3), and also fills the spaces (31) between adjacent busbars (3).