| 发明名称 | Packages having integrated devices and methods of forming same | ||
| 摘要 | An embodiment device package includes a discrete device, a first connector on a bottom surface of the discrete device, and a second connector on a top surface of the discrete device. The first connector bonds the discrete device to a first package component, and the second connector bonds the discrete device to a second package component. | ||
| 申请公布号 | US9385073(B2) | 申请公布日期 | 2016.07.05 |
| 申请号 | US201414463396 | 申请日期 | 2014.08.19 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Yeh Chao-Yang |
| 分类号 | H01L25/07;H01L23/498;H01L23/31;H01L21/48;H01L21/56;H01L25/00;H01L23/00 | 主分类号 | H01L25/07 |
| 代理机构 | Slater Matsil, LLP | 代理人 | Slater Matsil, LLP |
| 主权项 | 1. A device package comprising: a discrete device; a first contact pad over a first end of the discrete device, a top surface of the first contact pad being higher than a top surface of the discrete device and a bottom surface of the first contact pad being lower than a bottom surface of the discrete device; a first connector on the bottom surface of the first contact pad, wherein the first connector bonds the discrete device to a first package component; and a second connector on the top surface of the first contact pad, wherein the second connector bonds the discrete device to a second package component. | ||
| 地址 | Hsin-Chu TW | ||