发明名称 |
Packaging substrate having embedded interposer and fabrication method thereof |
摘要 |
A packaging substrate includes a carrier and an interposer. The carrier has opposite top and bottom surfaces. A recess is formed on the top surface and a plurality of first conductive terminals are formed on the recess. Further, a plurality of second conductive terminals are formed on the bottom surface of the carrier. The interposer is disposed in the recess and has opposite first and second surfaces and a plurality of conductive through vias penetrating the first and second surfaces. A first conductive pad is formed on an end of each of the conductive through vias exposed from the first surface, and a second conductive pad is formed on the other end of each of the conductive through vias exposed from the second surface and electrically connected to a corresponding one of the first conductive terminals. Compared with the prior art, the invention improves the product reliability. |
申请公布号 |
US9385056(B2) |
申请公布日期 |
2016.07.05 |
申请号 |
US201213566323 |
申请日期 |
2012.08.03 |
申请人 |
Unimicron Technology Corporation;Industrial Technology Research Institute |
发明人 |
Hu Dyi-Chung;Lau John Hon-Shing |
分类号 |
H01L23/14;H01L23/498;H01L23/13 |
主分类号 |
H01L23/14 |
代理机构 |
Mintz Levin Cohn Ferris Glovsky and Popeo, P.C. |
代理人 |
Mintz Levin Cohn Ferris Glovsky and Popeo, P.C. ;Corless Peter F.;Jensen Steven M. |
主权项 |
1. A fabrication method of a packaging substrate having an embedded interposer, comprising the steps of:
preparing a multi-layer interconnect base plate having opposite third and fourth surfaces, wherein the third surface has a plurality of first conductive terminals disposed thereon; forming a built-up structure on the third surface of the multi-layer interconnect base plate; removing a portion of the built-up structure through a laser so as to form a cavity and expose the plurality of first conductive terminals from the cavity, thereby providing a carrier having opposite top and bottom surfaces, wherein the carrier comprises the multi-layer interconnect base plate and the built-up structure having a recess, the recess is formed on the top surface of the carrier and the plurality of first conductive terminals are formed on the recess, and a plurality of second conductive terminals are formed on the bottom surface of the carrier for electrically connecting the carrier and an external electronic device; and disposing in the recess an interposer having opposite first and second surfaces and a plurality of conductive through vias penetrating the first and second surfaces, wherein a first conductive pad is formed on an end of each of the conductive through vias exposed from the first surface, and a second conductive pad is formed on the other end of each of the conductive through vias exposed from the second surface and electrically connected to a corresponding one of the first conductive terminals. |
地址 |
Taoyuan TW |