发明名称 Stacked thin channels for boost and leakage improvement
摘要 A hollow-channel memory device comprises a source layer, a first hollow-channel pillar structure formed on the source layer, and a second hollow-channel pillar structure formed on the first hollow-channel pillar structure. The first hollow-channel pillar structure comprises a first thin channel and the second hollow-channel pillar structure comprises a second thin channel that is in contact with the first thin channel. In one exemplary embodiment, the first thin channel comprises a first level of doping; and the second thin channel comprises a second level of doping that is different from the first level of doping. In another exemplary embodiment, the first and second levels of doping are the same.
申请公布号 US9412821(B2) 申请公布日期 2016.08.09
申请号 US201514933226 申请日期 2015.11.05
申请人 Intel Corporation 发明人 Simsek-Ege Fatma Arzum;Sun Jie Jason;Li Benben;Jayanti Srikant;Zhao Han;Huang Guangyu;Liu Haitao
分类号 H01L27/115;H01L27/06;H01L29/10 主分类号 H01L27/115
代理机构 Alpine Technology Law Group LLC 代理人 Alpine Technology Law Group LLC
主权项 1. A method to form a memory device, comprising: forming a source layer; forming a first pillar structure comprising a first thin channel on the source layer, the first thin channel comprising a first level of doping; and forming a second pillar structure on the first pillar structure, the second pillar structure comprising a second thin channel, the second thin channel comprising a second level of doping, and the second level of doping being different from the first level of doping.
地址 Santa Clara CA US