发明名称 |
Stacked thin channels for boost and leakage improvement |
摘要 |
A hollow-channel memory device comprises a source layer, a first hollow-channel pillar structure formed on the source layer, and a second hollow-channel pillar structure formed on the first hollow-channel pillar structure. The first hollow-channel pillar structure comprises a first thin channel and the second hollow-channel pillar structure comprises a second thin channel that is in contact with the first thin channel. In one exemplary embodiment, the first thin channel comprises a first level of doping; and the second thin channel comprises a second level of doping that is different from the first level of doping. In another exemplary embodiment, the first and second levels of doping are the same. |
申请公布号 |
US9412821(B2) |
申请公布日期 |
2016.08.09 |
申请号 |
US201514933226 |
申请日期 |
2015.11.05 |
申请人 |
Intel Corporation |
发明人 |
Simsek-Ege Fatma Arzum;Sun Jie Jason;Li Benben;Jayanti Srikant;Zhao Han;Huang Guangyu;Liu Haitao |
分类号 |
H01L27/115;H01L27/06;H01L29/10 |
主分类号 |
H01L27/115 |
代理机构 |
Alpine Technology Law Group LLC |
代理人 |
Alpine Technology Law Group LLC |
主权项 |
1. A method to form a memory device, comprising:
forming a source layer; forming a first pillar structure comprising a first thin channel on the source layer, the first thin channel comprising a first level of doping; and forming a second pillar structure on the first pillar structure, the second pillar structure comprising a second thin channel, the second thin channel comprising a second level of doping, and the second level of doping being different from the first level of doping. |
地址 |
Santa Clara CA US |