发明名称 Semiconductor device
摘要 A semiconductor device includes a semiconductor substrate of a first conductivity type, an impurity layer of a second conductivity type provided within the semiconductor substrate, an impurity region of the second conductivity type that is connected, within the semiconductor substrate, to the impurity layer, and separates a first region of the semiconductor substrate from a second region by surrounding the first region of the semiconductor substrate together with the impurity layer, a first well and second well of the second conductivity type that are provided on the impurity layer via at least a semiconductor layer of the first conductivity type, and a plurality of transistors provided to the semiconductor substrate.
申请公布号 US9412738(B2) 申请公布日期 2016.08.09
申请号 US201514677396 申请日期 2015.04.02
申请人 SEIKO EPSON CORPORATION 发明人 Furuhata Tomoyuki
分类号 H01L29/66;H01L27/088;H01L29/78;H01L29/36;H01L29/06;H01L21/8238;H01L27/092;H01L21/8234 主分类号 H01L29/66
代理机构 Oliff PLC 代理人 Oliff PLC
主权项 1. A semiconductor device comprising: a semiconductor substrate of a first conductivity type; an impurity layer of a second conductivity type disposed within the semiconductor substrate; an impurity region of the second conductivity type that is connected to the impurity layer within the semiconductor substrate, the impurity region and the impurity layer separating a first region of the semiconductor substrate from a second region of the semiconductor substrate by surrounding the first region of the semiconductor substrate; a first well and a second well of the second conductivity type disposed in the first region of the semiconductor substrate and separated from the impurity layer by at least a semiconductor layer of the first conductivity type; and a plurality of transistors disposed in the semiconductor substrate.
地址 Tokyo JP