| 摘要 |
Research on the practical use of various printable devices is advancing, and the achievement of devices in which the printable devices are integrated on flexible substrates is anticipated. However, when a plurality of printable devices are simply integrated on the same substrate, problems are presented in that the area of the integrated device increases and yield is significantly reduced. An integration technology for resolving the problems of increased area and reduced yield is needed. In the present invention, individual electronic devices to be integrated are formed independently on a substrate, and are overlaid in a prescribed relationship, whereupon through-vias are formed in prescribed locations and electrically connected, whereby the devices are caused to function as an integrated device. |
