| 摘要 |
The present invention provides a heat-curable resin composition comprising: (A) a polyimide resin having a structure represented by formula (1-a) and a structure represented by formula (1-b); and (B) at least one heat-curable resin selected from an epoxy resin, a bismaleimide resin, a cyanate ester resin, a bisallylnadic imide resin, a vinylbenzyl ether resin, a benzooxazine resin and a polymerization product of a bismaleimide with a diamine (in the formulae, the groups are as defined in the description). |
