| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package, while causing no decrease in the input impedance, even if an ESD (electrostatic discharge) is not installed on a semiconductor chip, without causing ESD breakdown or enlarging the size of a semiconductor device. <P>SOLUTION: Only parts 121, 122 that are related to an antenna matching circuit are embedded in a semiconductor package 1. Since the antenna body is provided at the outside of the semiconductor device, the semiconductor package can be designed freely, without being affected by the size of the semiconductor device, and will not result in sacrificing of the antenna performance. The matching circuits 121, 122 which are conductors and the semiconductor chip 13 are connected at two places. This corresponds to the DC short circuit to require no ESD protection circuit, causing no decrease in impedance. Further, the size of the semiconductor package 1 is within the size of general semiconductor devices. <P>COPYRIGHT: (C)2009,JPO&INPIT |
