| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for cutting a wafer, capable of effectively obtaining chips with stable quality.SOLUTION: A method for cutting a wafer includes: a grinding step of grinding the rear face of the wafer with a grindstone while the surface of the wafer is vacuum-sucked with a wafer chuck; a polishing step of, after the grinding step, polishing the rear face of the wafer using a polishing cloth; and a cutting step of, after the polishing step, cutting the wafer.SELECTED DRAWING: Figure 9 |
