发明名称 Hybrid phase field effect transistor
摘要 An insulating layer is deposited over a transistor structure. The transistor structure comprises a gate electrode over a device layer on a substrate. The transistor structure comprises a first contact region and a second contact region on the device layer at opposite sides of the gate electrode. A trench is formed in the first insulating layer over the first contact region. A metal-insulator phase transition material layer with a S-shaped IV characteristic is deposited in the trench or in the via of the metallization layer above on the source side.
申请公布号 US9455343(B2) 申请公布日期 2016.09.27
申请号 US201314040574 申请日期 2013.09.27
申请人 Intel Corporation 发明人 Pillarisetty Ravi;Doyle Brian S.;Karpov Elijah V.;Kencke David L.;Shah Uday;Kuo Charles C.;Chau Robert S.
分类号 H01L29/78;H01L29/66;H01L45/00;H01L27/24 主分类号 H01L29/78
代理机构 Blakely, Sokoloff, Taylor & Zafman LLP 代理人 Blakely, Sokoloff, Taylor & Zafman LLP
主权项 1. An electronic device, comprising: a gate electrode on a substrate, a pair of source/drain regions on the substrate at opposite sides of the gate electrode; a pair of contact layers coupled to the pair of source/drain regions; a metallization layer that is a part of a back end metallization of the electronic device over the pair of contact layers; a trench in an insulating layer to expose a portion of the metallization layer; and a metal-insulator phase transition material layer on the portion of the metallization layer within the trench.
地址 Santa Clara CA US