发明名称 |
Hybrid phase field effect transistor |
摘要 |
An insulating layer is deposited over a transistor structure. The transistor structure comprises a gate electrode over a device layer on a substrate. The transistor structure comprises a first contact region and a second contact region on the device layer at opposite sides of the gate electrode. A trench is formed in the first insulating layer over the first contact region. A metal-insulator phase transition material layer with a S-shaped IV characteristic is deposited in the trench or in the via of the metallization layer above on the source side. |
申请公布号 |
US9455343(B2) |
申请公布日期 |
2016.09.27 |
申请号 |
US201314040574 |
申请日期 |
2013.09.27 |
申请人 |
Intel Corporation |
发明人 |
Pillarisetty Ravi;Doyle Brian S.;Karpov Elijah V.;Kencke David L.;Shah Uday;Kuo Charles C.;Chau Robert S. |
分类号 |
H01L29/78;H01L29/66;H01L45/00;H01L27/24 |
主分类号 |
H01L29/78 |
代理机构 |
Blakely, Sokoloff, Taylor & Zafman LLP |
代理人 |
Blakely, Sokoloff, Taylor & Zafman LLP |
主权项 |
1. An electronic device, comprising:
a gate electrode on a substrate, a pair of source/drain regions on the substrate at opposite sides of the gate electrode; a pair of contact layers coupled to the pair of source/drain regions; a metallization layer that is a part of a back end metallization of the electronic device over the pair of contact layers; a trench in an insulating layer to expose a portion of the metallization layer; and a metal-insulator phase transition material layer on the portion of the metallization layer within the trench. |
地址 |
Santa Clara CA US |