CURRENT SENSOR ISOLATION

摘要

A current sensor integrated circuit includes a lead frame having a primary conductor and at least one secondary lead, a semiconductor die disposed adjacent to the primary conductor, an insulation structure disposed between the primary conductor and the semiconductor die, and a non-conductive insulative material enclosing the semiconductor die, the insulation structure, a first portion of the primary conductor, and a first portion of the at least one secondary lead to form a package. The first portion of the at least one secondary lead (between a first end proximal to the primary conductor and a second end proximal to the second, exposed portion of the at least one secondary lead) has a thickness that is less than a thickness of the second, exposed portion of the least one secondary lead. A distance between the second, exposed portion of the primary conductor and the second, exposed portion of the at least one secondary lead is at least 7.2 mm.

主权项

1. A current sensor integrated circuit comprising:
a lead frame having a primary conductor and at least one secondary lead; a semiconductor die disposed adjacent to the primary conductor and comprising a magnetic field sensing circuit to sense a magnetic field associated with a current through the primary conductor and to generate a secondary signal indicative of the current for coupling to the least one secondary lead; an insulation structure disposed between the primary conductor and the semiconductor die; and a non-conductive insulative material enclosing the semiconductor die, the insulation structure, a first portion of the primary conductor, and a first portion of the at least one secondary lead to form a package, wherein the insulation structure extends beyond a periphery of the primary conductor, wherein a second portion of the primary conductor and a second portion of the at least one secondary lead are exposed outside of the package, and wherein a distance between the second, exposed portion of the primary conductor and the second, exposed portion of the at least one secondary lead is at least approximately 7.2 mm.