Printed wiring board, printed circuit board, and method for manufacturing printed circuit board

摘要

A printed wiring board has a heat transfer pattern facing a heat sink of an electronic component, on a first surface layer on which the electronic component having the heat sink is mounted. The printed wiring board has a through hole conductor formed in a through hole penetrating the printed wiring board corresponding to the heat transfer pattern, and thermally connected to the heat transfer pattern. The heat transfer pattern has a plurality of connecting lands exposed so as to be connectable to the heat sink of the electronic component by solder while being divided by a solder resist. The plurality of the connecting lands include lands adjacent to the through holes, and lands not adjacent to the through holes. The heat dissipation of the electronic component is enhanced while enhancing the connectability of the heat transfer pattern with the heat sink of the electronic component, at being mounted.

主权项

1. A printed circuit board comprising
a printed wiring board, wherein the printed wiring board comprises a first surface layer on which an electronic component is mounted, wherein a heat transfer pattern is formed in an area of the first surface on which the electronic component is mounted, a second surface layer positioned on a side of the printed wiring board, opposite to the first surface layer, wherein a first conductive pattern is formed in an area of the second surface, and a through hole penetrating the printed wiring board in a thickness direction thereof, wherein the through hole is formed in the area in which the heat transfer pattern is formed, a through hole conductor is formed within the through hole, and the through hole conductor is thermally connected to the heat transfer pattern and the first conductive pattern; an electronic component having a heat sink mounted on the first surface layer of the printed wiring board; and a solder joint portion arranged between the heat sink of the electronic component and the heat transfer pattern of the printed wiring board, wherein the heat transfer pattern is covered with a solder resist, and is exposed from the solder resist to form a plurality of connecting lands, wherein the plurality of connecting lands comprises a first land group including a plurality of first lands, and a second land group including a plurality of second lands, each of the first lands is arranged adjacent to the through hole, and the each of the second lands is not arranged adjacent to the through hole, and wherein at least one of the first lands is not connected through the solder joint portion to the heat sink, the second lands are connected through the solder joint portion to the heat sink, the solder is solidified within the at least one of the through holes.