| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad excellent in polishing speed, scratches of a surface to be polished, and in-plane uniformity of a surface to be polished, and exhibiting stabilized polishing speed even when continuously polishing a number of bodies to be polished. <P>SOLUTION: A method of manufacturing chemical mechanical polishing pad includes: (1) a step of manufacturing a sheet like high polymer molding; (2) and a step of irradiating the sheet like high polymer molding with an electron beam in a range of irradiation dose of 10 to 400 kGy. <P>COPYRIGHT: (C)2009,JPO&INPIT |
